Invention Grant
- Patent Title: Chemical mechanical polishing apparatus and method
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Application No.: US15136706Application Date: 2016-04-22
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Publication No.: US09962805B2Publication Date: 2018-05-08
- Inventor: Ting-Kui Chang , Fu-Ming Huang , Liang-Guang Chen , Chun-Chieh Lin
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: B24B37/00
- IPC: B24B37/00 ; B24B37/20 ; B24B37/005
Abstract:
A polisher head of a polishing apparatus includes a membrane and a first local pressure nodule and a second local pressure nodule physically contacting the membrane. The first local pressure nodule is configured to apply a first local force to the membrane and the second local pressure nodule is configured to apply a second local force to the membrane. The first local pressure nodule and the second local pressure nodule are independently controllable.
Public/Granted literature
- US20170304990A1 Chemical Mechanical Polishing Apparatus and Method Public/Granted day:2017-10-26
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