Invention Grant
- Patent Title: Wafer arrangement and method for processing a wafer
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Application No.: US14490705Application Date: 2014-09-19
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Publication No.: US09966293B2Publication Date: 2018-05-08
- Inventor: Francisco Javier Santos Rodriguez , Gerald Lackner , Josef Unterweger
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Agency: Viering, Jentschura & Partner mbB
- Main IPC: B65D85/02
- IPC: B65D85/02 ; H01L21/683 ; H01L21/304
Abstract:
A wafer arrangement in accordance with various embodiments may include: a wafer; and a wafer support ring, wherein the wafer and the wafer support ring are configured to be releasably attachable to one another.
Public/Granted literature
- US20160086838A1 WAFER ARRANGEMENT AND METHOD FOR PROCESSING A WAFER Public/Granted day:2016-03-24
Information query
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