Invention Grant
- Patent Title: Connector assembly
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Application No.: US15163952Application Date: 2016-05-25
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Publication No.: US09966684B2Publication Date: 2018-05-08
- Inventor: Byunghoon Ko , Hyungwoo Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2015-0179457 20151215
- Main IPC: H01R13/24
- IPC: H01R13/24 ; H01R13/52 ; H01R13/627 ; H01R12/78 ; H01R13/62

Abstract:
A connector assembly includes a first connector body, a first elastic layer disposed on the first connector, a first electrode disposed on the first elastic layer, a second connector body, and a second electrode disposed on the second connector, wherein the first elastic layer is configured to provide a compressive force to the first electrode when the first connector body engages the second connector body.
Public/Granted literature
- US20170170590A1 CONNECTOR ASSEMBLY Public/Granted day:2017-06-15
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