- 专利标题: Methods and apparatus for a rail-mounted array assembly
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申请号: US15060471申请日: 2016-03-03
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公开(公告)号: US09967978B1公开(公告)日: 2018-05-08
- 发明人: Robert Eiermann , Paul J. Gavin , Steven D. Bernstein , David L. Hall
- 申请人: Raytheon Company
- 申请人地址: US MA Waltham
- 专利权人: Raytheon Company
- 当前专利权人: Raytheon Company
- 当前专利权人地址: US MA Waltham
- 主分类号: H05K7/14
- IPC分类号: H05K7/14 ; H05K1/14 ; H05K1/02 ; H05K3/36 ; H05K13/00 ; H05K7/20
摘要:
A rear-loaded electronics array, comprising a first circuit board assembly comprising a rail and at least one slat assembly. The at least one slat assembly can be operable to be removed from the rail and replaced on the rail from a rearward position. A second circuit board assembly can comprise a rail and at least one slat assembly. The at least one slat assembly can be operable to be removed from the rail and replaced on the rail from a rearward position. The first circuit board assembly can be positioned adjacent the second circuit board assembly, and the first circuit board assembly can be coupled to the second circuit board assembly, thus forming the rear-loaded electronics array. The first and second circuit board assemblies can be installed and removed independent of one another, as well as each of the individual slat assemblies from any circuit board assembly.
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