Invention Grant
- Patent Title: Electronic component, mounted electronic component, and method for mounting electronic component
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Application No.: US15389484Application Date: 2016-12-23
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Publication No.: US09967980B2Publication Date: 2018-05-08
- Inventor: Akio Masunari , Hirokazu Takashima , Tomoyuki Nakamura
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2016-006292 20160115
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K1/18 ; H01G4/005 ; H01G4/12 ; H01G4/248 ; H01G4/30 ; H05K1/11 ; H05K3/34
Abstract:
A multilayer ceramic capacitor includes a ceramic element body including first and second external electrodes on first and second end surface sides of the ceramic element body, respectively. The first external electrode includes an Ni plating layer and an Sn plating layer defining a plating layer. The second external electrode includes an Au plating layer defining a plating layer.
Public/Granted literature
- US20170208691A1 ELECTRONIC COMPONENT, MOUNTED ELECTRONIC COMPONENT, AND METHOD FOR MOUNTING ELECTRONIC COMPONENT Public/Granted day:2017-07-20
Information query
