Invention Grant
- Patent Title: Pressure sensitive adhesive including a 1,1-disubstituted alkene compound
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Application No.: US15589364Application Date: 2017-05-08
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Publication No.: US09969819B2Publication Date: 2018-05-15
- Inventor: Aniruddha Palsule , Alexander R. Holzer , Peter Rulon Stevenson , Kshitij Kishen Parab , Jeffrey M. Sullivan
- Applicant: Sirrus, Inc.
- Applicant Address: US OH Loveland
- Assignee: Sirrus, Inc.
- Current Assignee: Sirrus, Inc.
- Current Assignee Address: US OH Loveland
- Agency: Young Basile Hanlon & MacFarlane, P.C.
- Main IPC: C09J7/38
- IPC: C09J7/38 ; C08F2/06 ; C08F222/14 ; C09J153/00 ; C09J135/02
Abstract:
The present teachings show that it is possible to polymerize 1,1-disubstituted alkene compounds in a solution (for example using one or more solvents). Polymerization of 1,1-disubstituted alkene compounds in an solution provides opportunities to better control the polymerization compared with bulk polymerization. The solution polymerization techniques can be employed for preparing homopolymers, copolymers (e.g., random copolymers), and block copolymers.
Public/Granted literature
- US20170253675A1 PRESSURE SENSITIVE ADHESIVE INCLUDING A 1,1-DISUBSTITUTED ALKENE COMPOUND Public/Granted day:2017-09-07
Information query
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