Invention Grant
- Patent Title: Gas sensor package
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Application No.: US14487452Application Date: 2014-09-16
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Publication No.: US09970911B2Publication Date: 2018-05-15
- Inventor: Jee Heum Paik , Ji Hun Hwang
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Ked & Associates, LLP
- Priority: KR10-2013-0111261 20130916; KR10-2014-0034575 20140325
- Main IPC: G01N33/00
- IPC: G01N33/00 ; G01N27/12
Abstract:
A gas sensor package includes a substrate, a gas sensing element on the substrate, and a cover module including ventilation holes.
Public/Granted literature
- US20150075257A1 GAS SENSOR PACKAGE Public/Granted day:2015-03-19
Information query
