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    Gas sensor package
    3.
    发明授权
    Gas sensor package 有权

    公开(公告)号：US09851336B2

    公开(公告)日：2017-12-26

    申请号：US14486450

    申请日：2014-09-15

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Jee Heum Paik ,  Ji Hun Hwang

    IPC: G01N7/00 ,  G01N33/00 ,  G01N27/04

    CPC classification number: G01N33/0027 ,  G01N27/041

    Abstract: A gas sensor package is configured such that an output change part is provided in the gas sensor package including a gas sensor so that a resistance output mode can be changed to a voltage output mode, thereby enabling the gas sensor to have a regular initial voltage value by compensating a resistance change value to an initial gas sensing material. According to embodiments of the present application, a gas sensor package is configured such that a gas moving separation part is formed between a gas sensing element and a substrate with regard to a structure in which a gas sensing element is mounted to the substrate in a flip chip bonding method so that gas can be smoothly moved and thus gas sensing efficiency can be maximized.

    Gas sensor package
    4.
    发明授权
    Gas sensor package 有权

    公开(公告)号：US10126258B2

    公开(公告)日：2018-11-13

    申请号：US15529057

    申请日：2015-11-17

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Jee Heum Paik ,  Ji Hun Hwang

    IPC: H01L27/14 ,  G01N27/12 ,  H01L29/08 ,  H01L23/055 ,  H01L23/498 ,  H01L23/00

    Abstract: The present invention relates to a gas sensor package including an insulating substrate, a metal layer on one surface of the insulating substrate, a stepped portion disposed on the metal layer and configured to divide the metal layer into a plurality of portions, and a gas sensor chip mounted on the metal layer located on the stepped portion and including a sensing part, wherein a width of the stepped portion is provided to be equal to or less than an interval between two adjacent electrode terminals of a plurality of electrode terminals of the gas sensor chip.

    GAS SENSOR PACKAGE
    5.
    发明申请
    GAS SENSOR PACKAGE 有权
    气体传感器包装

    公开(公告)号：US20150075258A1

    公开(公告)日：2015-03-19

    申请号：US14486450

    申请日：2014-09-15

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Jee Heum PAIK ,  Ji Hun Hwang

    IPC: G01N33/00 ,  G01N27/04

    CPC classification number: G01N33/0027 ,  G01N27/041

    Abstract: A gas sensor package is configured such that an output change part is provided in the gas sensor package including a gas sensor so that a resistance output mode can be changed to a voltage output mode, thereby enabling the gas sensor to have a regular initial voltage value by compensating a resistance change value to an initial gas sensing material. According to embodiments of the present application, a gas sensor package is configured such that a gas moving separation part is formed between a gas sensing element and a substrate with regard to a structure in which a gas sensing element is mounted to the substrate in a flip chip bonding method so that gas can be smoothly moved and thus gas sensing efficiency can be maximized.

    Abstract translation: 气体传感器组件被构造成使得在包括气体传感器的气体传感器组件中设置输出变化部件，使得可以将电阻输出模式改变为电压输出模式，从而使得气体传感器能够具有规则的初始电压值 通过补偿初始气体感测材料的电阻变化值。 根据本申请的实施例，气体传感器封装构造成使得在气体感测元件和衬底之间形成气体移动分离部件相对于其中气体感测元件在翻转中安装到衬底的结构 芯片接合方法，使得气体可以平滑地移动，从而可以最大化气体感测效率。

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