Invention Grant
- Patent Title: Fan module
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Application No.: US14632548Application Date: 2015-02-26
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Publication No.: US09976558B2Publication Date: 2018-05-22
- Inventor: Chienlung Yang , Kuan-Ting Wu
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: HPI Patent Department
- Main IPC: F04D17/04
- IPC: F04D17/04 ; F04D17/12 ; F04D25/06

Abstract:
Example implementations relate to a fan module. The fan module may include an outer impeller having a first plurality of radial blades arranged between an inner circumference of the outer impeller and an outer circumference of the outer impeller. The outer impeller may be rotatable about a first axis of rotation. The fan module may include an inner impeller having a second plurality of radial blades, the inner impeller disposed within the inner circumference of the outer impeller and rotatable about a second axis of rotation.
Public/Granted literature
- US20160252096A1 FAN MODULE Public/Granted day:2016-09-01
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