Invention Grant
- Patent Title: Electro-conductive pressure-sensitive adhesive tape, an electronic member, and a pressure-sensitive adhesive
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Application No.: US14553532Application Date: 2014-11-25
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Publication No.: US09982170B2Publication Date: 2018-05-29
- Inventor: Shu Sasaki , Jyunichi Nakayama , Rie Yuto , Yoshio Terada
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Ibaraki-shi, Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Ibaraki-shi, Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2013-245230 20131127; JP2014-226174 20141106
- Main IPC: B32B5/16
- IPC: B32B5/16 ; C09J9/02 ; C09J7/00 ; C09J11/00 ; C09J133/08 ; C08K7/16 ; C08K9/02 ; H05K3/32

Abstract:
An electro-conductive pressure-sensitive adhesive tape comprises a pressure-sensitive adhesive layer containing a resin component and an electro-conductive particle. The electro-conductive particle has at least one peak top existing in a particle size range from about 15 μm or more to about 50 μm or less and at least one further peak top existing in a particle size range from about 1 μm or more to about 12 μm or less in a particle size distribution curve thereof. The electro-conductive particle is contained in the pressure-sensitive adhesive layer in an amount of 40 mass % or more but 80 mass % or less, and has a true density in a level of larger than zero but smaller than 8 g/cm3.
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