公开(公告)号：US09982170B2

公开(公告)日：2018-05-29

申请号：US14553532

申请日：2014-11-25

Applicant: NITTO DENKO CORPORATION

Inventor： Shu Sasaki ,  Jyunichi Nakayama ,  Rie Yuto ,  Yoshio Terada

IPC: B32B5/16 ,  C09J9/02 ,  C09J7/00 ,  C09J11/00 ,  C09J133/08 ,  C08K7/16 ,  C08K9/02 ,  H05K3/32

CPC classification number: C09J9/02 ,  C08K7/16 ,  C08K9/02 ,  C08K2201/001 ,  C08K2201/005 ,  C09J7/00 ,  C09J7/10 ,  C09J11/00 ,  C09J133/08 ,  C09J2201/602 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2433/00 ,  G02F2202/16 ,  G02F2202/28 ,  H05K3/323 ,  Y10T428/25 ,  Y10T428/256

Abstract: An electro-conductive pressure-sensitive adhesive tape comprises a pressure-sensitive adhesive layer containing a resin component and an electro-conductive particle. The electro-conductive particle has at least one peak top existing in a particle size range from about 15 μm or more to about 50 μm or less and at least one further peak top existing in a particle size range from about 1 μm or more to about 12 μm or less in a particle size distribution curve thereof. The electro-conductive particle is contained in the pressure-sensitive adhesive layer in an amount of 40 mass % or more but 80 mass % or less, and has a true density in a level of larger than zero but smaller than 8 g/cm3.