- 专利标题： Integrated circuit having slot via and method of forming the same
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申请号： US15681874申请日： 2017-08-21
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公开(公告)号： US09984964B2公开(公告)日： 2018-05-29
- 发明人: Wei-Cheng Lin , Charles Chew-Yuen Young , Jiann-Tyng Tzeng , Praneeth Narayanasetti
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Haynes and Boone, LLP
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L21/4763 ; H01L21/44 ; H01L23/522 ; H01L23/532 ; H01L23/528 ; H01L21/768 ; H01L23/485
摘要：
An integrated circuit includes a first conductive line on a first metal level of the integrated circuit. The integrated circuit further includes a second conductive line on a second metal level of the integrated circuit. The integrated circuit further includes a slot via electrically connecting the first conductive line with the second conductive line. The slot via overlaps with the first conductive line and the second conductive line. The slot via extends beyond a periphery of at least one of the first conductive line or the second conductive line.
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