Invention Grant
- Patent Title: Devices and methods to compress sensor data
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Application No.: US15279307Application Date: 2016-09-28
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Publication No.: US09986069B2Publication Date: 2018-05-29
- Inventor: Fai Yeung , Jinshi James Huang
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H04L12/26
- IPC: H04L12/26 ; H04L29/06 ; H04B1/3827 ; H04W4/00

Abstract:
Devices and methods to compress sensor data are generally described herein. An exemplary wearable device to compress sensor data may include a sensor including circuitry to sense sensor data, and a communication circuit to receive, from a remote device, a detected link quality of a low-power communication channel used to communicate with the remote device. The communication circuit further to transmit compressed data to a remote device over the low power communication channel. The wearable device may further include a compressible sensor data module to apply a compression algorithm to compress received sensor data based on the detected link quality to provide the compressed sensor data.
Public/Granted literature
- US20180091630A1 DEVICES AND METHODS TO COMPRESS SENSOR DATA Public/Granted day:2018-03-29
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