- 专利标题： Method for operating a polishing head and method for polishing a substrate
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申请号： US15008707申请日： 2016-01-28
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公开(公告)号： US09987720B2公开(公告)日： 2018-06-05
- 发明人: Shich-Chang Suen , Chin-Hsiang Chan , Liang-Guang Chen , Yung-Cheng Lu
- 申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 申请人地址： TW Hsinchu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人地址： TW Hsinchu
- 代理机构： McDermott Will & Emery LLP
- 主分类号： B24B37/20
- IPC分类号： B24B37/20 ; B24D9/08 ; B24B37/005 ; B24B49/10 ; B24B37/30 ; B24B37/04 ; B24B41/06
摘要：
A method for operating a polishing head is provided. The method includes keeping a stator of at least one electromagnetism actuated pressure sector stationary with respect to a carrier head, and electromagnetically and linearly moving an active cell of the electromagnetism actuated pressure sector with the stator to linearly move the active cell with respect to the carrier head.
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