This liquid sealing material has low thermal expansion and has injection properties for injection into gaps between a semiconductor element and a substrate; this electronic component is formed by sealing a sealing site using the liquid sealing material. This liquid sealing material is characterized by containing (A) a liquid epoxy resin, (B) a curing agent, (C) a silica filler with an average particle diameter of 7-50 nm, surface treated with 2-(3,4-epoxy cyclohexyl) ethyl trimethoxysilane, and (D) a silica filler with an average particle diameter of 0.2-5 μm, wherein relative to a total of 100 parts by mass of all components of the liquid sealing material, the total of the silica filler of component (C) and the silica filler of the component (D) is 45-77 parts by mass, and the mixing ratio (weight ratio) of the silica filler of component (C) and the silica filler of component (D) is 1:10.2-1:559.