Invention Grant
- Patent Title: Heat pipe
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Application No.: US14807312Application Date: 2015-07-23
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Publication No.: US09995537B2Publication Date: 2018-06-12
- Inventor: Hirofumi Aoki , Masami Ikeda , Yoshikatsu Inagaki
- Applicant: FURUKAWA ELECTRIC CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2013-012540 20130125
- Main IPC: F28D15/00
- IPC: F28D15/00 ; F28D15/04 ; F28F3/02 ; F28D15/02

Abstract:
The purpose of this invention is to provide a sheet-shaped heat pipe that makes it possible to reduce a pressure loss caused by a vapor flow or a pressure loss caused by a working fluid flow to improve the maximum amount of heat to be transported and reduce thermal resistance by increasing the cross-sectional area of a vapor flow passage or a fluid flow passage, which has been limited by the length of a container in a height direction. A heat pipe (20) is provided with a protruding portion (24) so that the height of the wick-occupied portion (23) serving as the fluid flow passage is larger than the height of the space portion (22) serving as the vapor flow passage.
Public/Granted literature
- US20150330717A1 HEAT PIPE Public/Granted day:2015-11-19
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