再颁专利
- 专利标题： Method of preparing a printed circuit board
- 专利标题（中）： 印刷电路板的制备方法
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申请号： US09159360申请日： 1998-09-23
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公开(公告)号： USRE37840E1公开(公告)日： 2002-09-17
- 发明人: Anilkumar C. Bhatt , Roy H. Magnuson , Voya R. Markovich , Konstantinos I. Papathomas , Douglas O. Powell
- 申请人： Anilkumar C. Bhatt , Roy H. Magnuson , Voya R. Markovich , Konstantinos I. Papathomas , Douglas O. Powell
- 主分类号： H01K316
- IPC分类号： H01K316
摘要：
Disclosed is a printed circuit board and a method of preparing the printed circuit board. The printed circuit board has two types of plated through holes. The first type of plated through holes extend to and through an exterior surface of the printed circuit board for receipt of a pin-in-through-hole module or component pin. The second type of plated through holes are for surface mount technology and terminate below the exterior surfaces of the printed circuit board. These plated through holes contain a bill composition.
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