Invention Application
- Patent Title: TRANSIENT LIQUID PHASE CERAMIC BONDING
- Patent Title (中): 瞬态液相陶瓷接合
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Application No.: PCT/US1994008313Application Date: 1994-08-10
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Publication No.: WO1995004627A1Publication Date: 1995-02-16
- Inventor: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA , GLAESER, Andreas, M.
- Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
- Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
- Current Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
- Priority: US8/105,049 19930810
- Main IPC: B23K31/02
- IPC: B23K31/02
Abstract:
Ceramics are joined to themselves or to metals using a transient liquid phase method employing three layers, one of which (18) is a refractory metal, ceramic or alloy. The refractory layer (18) is placed between two metal layers (20 and 22), each of which has a lower melting point than the refractory layer. The three layers are pressed between the two articles to be bonded (14 and 16) to form an assembly (12). The assembly is heated to a bonding temperature at which the refractory layer remains solid, but the two metal layers melt to form a liquid. The refractory layer reacts with the surrounding liquid and a single solid bonding layer is eventually formed. The layers may be designed to react completely with each other and form refractory intermetallic bonding layers. Another method for joining ceramic articles employs a ceramic interlayer sandwiched between two metal layers.
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