The invention concerns a multi-layer foil printed circuit board which comprises rigid areas (s) and flexible areas (f) and has more foil layers in the rigid areas than in the flexible areas. The foil printed circuit board is produced by removal of at least the outermost foil layer (1.2) or reduction of its thickness by etching at least on one side in the flexible areas (f) provided. By appropriate configuration of the etching mask, the flexible areas (f) can be made to merge continuously into rigid areas (s) as a result of less material being removed from the layers in the edge areas (u) than in the centre (z) of the flexible area (f), so that the flexible areas do not have any edge areas tending to kink. The flexible areas can be etched in the same step as the etching of the through-plating holes in the corresponding foil layer (1.2) or in a separating etching step.