The invention concerns an arrangement for forming discrete soldering joints in which connection sections (26) of contact elements (14) are shaped to form loops (27) or eyes (28) and each contain a solder deposit (31). The connection sections (26) are pressed in a force-locking manner by spring elements (33) onto associated insular connection surfaces (32). Owing to the supply of heat, which melts solder (29) in the solder deposit (31), the solder passes directly to the connection surfaces (32) whilst continuing to wet the connection sections (26) and forming discrete soldering joints (34). The arrangement is preferably intended for use with electric circuits in motor vehicles.