Invention Application
WO1998002919A1 METHOD AND MOLD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND METHOD FOR MOUNTING THE DEVICE
审中-公开
用于制造半导体器件的方法和模具，半导体器件以及用于安装器件的方法
- Patent Title: METHOD AND MOLD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND METHOD FOR MOUNTING THE DEVICE
- Patent Title (中): 用于制造半导体器件的方法和模具，半导体器件以及用于安装器件的方法
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Application No.: PCT/JP1997002405Application Date: 1997-07-10
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Publication No.: WO1998002919A1Publication Date: 1998-01-22
- Inventor: FUJITSU LIMITED
- Applicant: FUJITSU LIMITED , FUKASAWA, Norio , KAWAHARA, Toshimi , MORIOKA, Muneharu , OSAWA, Mitsunada , SHINMA, Yasuhiro , MATSUKI, Hirohisa , ONODERA, Masanori , KASAI, Junichi , MARUYAMA, Shigeyuki , SAKUMA, Masao , SUZUKI, Yoshimi , TAKENAKA, Masashi
- Assignee: FUJITSU LIMITED,FUKASAWA, Norio,KAWAHARA, Toshimi,MORIOKA, Muneharu,OSAWA, Mitsunada,SHINMA, Yasuhiro,MATSUKI, Hirohisa,ONODERA, Masanori,KASAI, Junichi,MARUYAMA, Shigeyuki,SAKUMA, Masao,SUZUKI, Yoshimi,TAKENAKA, Masashi
- Current Assignee: FUJITSU LIMITED,FUKASAWA, Norio,KAWAHARA, Toshimi,MORIOKA, Muneharu,OSAWA, Mitsunada,SHINMA, Yasuhiro,MATSUKI, Hirohisa,ONODERA, Masanori,KASAI, Junichi,MARUYAMA, Shigeyuki,SAKUMA, Masao,SUZUKI, Yoshimi,TAKENAKA, Masashi
- Priority: JP8/183844 19960712; JP8/276634 19961018; JP9/10683 19970123; JP9/181132 19970707
- Main IPC: H01L21/56
- IPC: H01L21/56
Abstract:
A method for manufacturing semiconductor devices includes a resin sealing step of putting a substrate (16) on which bumps (12) and a plurality of semiconductor chips (11) are arranged in the cavity (28) of a mold (20) and supplying a resin (35) to the region where the bumps (12) are provided so as to coat the bumps (12) and form a resin layer (13), a protruded electrode exposing step of exposing at least the front end sections of the bumps (12) coated with the resin layer (13) from the layer (13), and a separating step of separating the semiconductor chips (11) into individual chips (11) by cutting the substrate (16) together with the layer (13).
Information query
IPC分类:
