Invention Application
- Patent Title: METHOD OF PARTIALLY PLATING ELECTRONIC COMPONENT BOARD
- Patent Title (中): 部分电子元件板的方法
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Application No.: PCT/JP1997002988Application Date: 1997-08-27
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Publication No.: WO1998009328A1Publication Date: 1998-03-05
- Inventor: NIPPON STEEL CORPORATION
- Applicant: NIPPON STEEL CORPORATION , TATSUMI, Kohei , SHIMOKAWA, Kenji , HASHINO, Eiji
- Assignee: NIPPON STEEL CORPORATION,TATSUMI, Kohei,SHIMOKAWA, Kenji,HASHINO, Eiji
- Current Assignee: NIPPON STEEL CORPORATION,TATSUMI, Kohei,SHIMOKAWA, Kenji,HASHINO, Eiji
- Priority: JP8/244268 19960827
- Main IPC: H01L23/12
- IPC: H01L23/12
Abstract:
Specific portions to be plated are easily selected and the plating material quantity is arbitrarily controlled with a high precision. After minute metal balls (24) are arranged in a via-hole part (22) of a TAB tape (21) and bonded or joined to it, the minute metal balls (24) are melted to coat a copper wiring (23) which is exposed from the via-hole part of the TAB tape (21) with different type of metal selectively. With this constitution, the specific portions of an electronic component board can be partially plated easily with a high precision.
Information query
IPC分类:
