公开(公告)号：WO1998009332A1

公开(公告)日：1998-03-05

申请号：PCT/JP1997002987

申请日：1997-08-27

Applicant: NIPPON STEEL CORPORATION ,  TATSUMI, Kohei ,  SHIMOKAWA, Kenji ,  HASHINO, Eiji

Inventor： NIPPON STEEL CORPORATION

IPC: H01L23/485

CPC classification number: H01L24/05 ,  H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/742 ,  H01L24/81 ,  H01L24/94 ,  H01L2224/0345 ,  H01L2224/03828 ,  H01L2224/0401 ,  H01L2224/05023 ,  H01L2224/05026 ,  H01L2224/05027 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05084 ,  H01L2224/05111 ,  H01L2224/05116 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/14131 ,  H01L2224/16227 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  Y10T29/49222 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2224/1308 ,  H01L2224/13099 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05611 ,  H01L2224/05669 ,  H01L2224/11 ,  H01L2924/00012

Abstract: A semiconductor device (1) comprising electrodes formed on a semiconductor chip (2) and bumps (3) which consist of a low melting point metal ball spherically formed and having a given size and which are adhesive bonded to the electrodes (5). The electrodes (5) are formed from an electrode material of Cu or a Cu alloy, Al or an Al alloy, or Au or a Au alloy. When the electrode material is composed of Al or an Al alloy, the electrodes contain, on the electrode material layer of Al or an Al alloy, at least one layer (6) composed of a metal or metal alloy (preferably a metal selected from Ti, W, Ni, Cr, Au, Pd, Cu, Pt, Ag, Sn or Pb, or an alloy of these metals) having a melting point higher than the electrode material. The low melting point metal balls (3) are adhesive bonded to the electrodes (5) preferably with a flux. The low melting point metal balls (3) adhesive bonded to the respective electrodes (3) may also be reflowed to form semispherical bumps (10) before use.

Abstract translation: 一种半导体器件（1），包括形成在半导体芯片（2）上的电极和由球形并且具有给定尺寸并且与电极（5）粘合的低熔点金属球组成的凸块（3）。 电极（5）由Cu或Cu合金，Al或Al合金或Au或Au合金的电极材料形成。 当电极材料由Al或Al合金构成时，电极在Al或Al合金的电极材料层上含有至少一层由金属或金属合金构成的层（6），优选选自Ti ，W，Ni，Cr，Au，Pd，Cu，Pt，Ag，Sn或Pb，或这些金属的合金）。 低熔点金属球（3）优选用助焊剂粘合到电极（5）上。 粘结到各个电极（3）上的粘合剂的低熔点金属球（3）也可以在使用前被回流以形成半球形凸块（10）。

公开(公告)号：WO1998009487A1

公开(公告)日：1998-03-05

申请号：PCT/JP1997003038

申请日：1997-08-29

Applicant: NIPPON STEEL CORPORATION ,  SHIMOKAWA, Kenji ,  TATSUMI, Kohei ,  HASHINO, Eiji

Inventor： NIPPON STEEL CORPORATION

IPC: H05K03/34

CPC classification number: B23K1/203 ,  H05K3/3489

Abstract: A method and device for supplying flux by which flux (6) can be supplied appropriately to an electrode section (2) of electronic parts (1) containing a semiconductor chip and a printed circuit board. The device is provided with a discharge nozzle (10) having a means which discharges the flux (6) in drops and the flux (6) is discharged in drops from the nozzle (10) and adhered to the electrode section (2) by a required amount. The discharge nozzle (10) of another device of this invention is provided with a continuously exciting means (23) which discharges the flux (6) in a continuous jet while the means (23) excites part of the flux (6), a splitting means (21) which splits the discharged continuous jet into a uniform particle train, and an electrifying means (22) which controls the direction of the jet by electrifying the uniform particle train so as to adhere the flux (6) to the electrode section (2) by a required amount.

Abstract translation: 一种用于供给焊剂的方法和装置，通过该焊剂可以将含有半导体芯片和印刷电路板的电子部件（1）的电极部（2）适当地供给焊剂（6）。 该装置设置有排出喷嘴（10），该喷嘴具有将液滴（6）以液滴的形式排出的装置，并且焊剂（6）从喷嘴（10）以液滴的形式排出，并通过一个 所需金额 本发明另一装置的排放喷嘴（10）设置有连续激励装置（23），其以连续喷射的方式排放焊剂（6），同时装置（23）激发焊剂（6）的一部分，分裂 将排出的连续射流分成均匀的粒子列的装置（21）和通过使均匀的粒子列通过控制喷射方向以使焊剂（6）附着到电极部（22）的通电装置（22） 2）所需数量。

公开(公告)号：WO1998034273A1

公开(公告)日：1998-08-06

申请号：PCT/JP1997003011

申请日：1997-08-28

Applicant: NIPPON STEEL CORPORATION ,  SHIMOKAWA, Kenji ,  HASHINO, Eiji ,  TATSUMI, Kohei

Inventor： NIPPON STEEL CORPORATION

IPC: H01L21/321

CPC classification number: H05K3/3478 ,  H01L21/4853 ,  H01L24/11 ,  H01L2224/05624 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01054 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15788 ,  H05K1/0269 ,  H05K2201/0108 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/082 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A ball arranging substrate is provided with a substrate having a main surface and a plurality of arranging holes for holding fine conductive balls by suction formed on the main surface at the positions corresponding to the electrodes of a semiconductor element, circuit board, etc. At the time of optically discriminating the normal/abnormal condition of the arranging state of the fine conductive balls from the light reflected from the ball arranging surface of the substrate on which the balls are held by suction by irradiating the ball arranging surface with light, the wavelength of the irradiating light is set within the range of 300-900 nm and, at the same time, the reflectance of the ball arranging surface to the light is set at

Abstract translation: 球排列基板具有基板，该基板具有主表面和多个用于在与半导体元件，电路板等的电极对应的位置处的主表面上形成的吸引保持微小导电球的排列孔。在 通过用光照射球排列表面，通过抽吸来光学地鉴别导电球的布置状态的正常/异常状况与通过吸力保持球的基底的球排列表面反射的光，波长 将照射光设定在300-900nm的范围内，同时将球排列面对光的反射率设定为<50％。 然而，当布置基板具有透光性时，通过将反射镜定位在与基板相反的一侧上的光源来测量反射率。

公开(公告)号：WO1998022576A1

公开(公告)日：1998-05-28

申请号：PCT/JP1996003425

申请日：1996-11-21

Applicant: MITSUBISHI KAGAKU SANSHI CORPORATION ,  CHIYODA CORPORATION ,  TOABO CO., LTD. ,  TACHIBANA, Yorinobu ,  IMAI, Hiroshi ,  SUGIMOTO, Chotaro ,  NAKAMURA, Mitsuo ,  HASEGAWA, Jun ,  SATOH, Hiromi ,  SUNAGA, Yoichi ,  SHIMOKAWA, Kenji ,  SAITOH, Masahi

Inventor： MITSUBISHI KAGAKU SANSHI CORPORATION ,  CHIYODA CORPORATION ,  TOABO CO., LTD.

IPC: C12N11/00

CPC classification number: C02F3/103 ,  C12N11/02 ,  Y02W10/15

Abstract: A carrier for deposition of microorganisms, comprising a web W1 comprising a first fiber of a polyolefin resin and a second fiber of a polyolefin resin having a melting temperature below that of the first fiber, and a nonwoven fabric f1 as a base layer, wherein the web W1 is adhered to the nonwoven fabric f1 by means of needle punching and the first fiber and the second fiber are mutually bound by taking advantage of melting of the second fiber with the first fiber bound to the nonwoven fabric f1. According to this carrier, the separation of the first fiber contributing to the deposition of microorganisms can be prevented, and at the same time gathering of the web by means of needle punching can be prevented with the aid of the nonwoven fabric f1, eliminating a variation in weight.

Abstract translation: 一种用于沉积微生物的载体，其包含纤维网W1，其包含聚烯烃树脂的第一纤维和熔融温度低于第一纤维的熔融温度的聚烯烃树脂的第二纤维，以及作为基层的无纺布f1，其中 纤维网W1通过针刺粘附到无纺布f1上，并且第一纤维和第二纤维通过利用与无纺布f1结合的第一纤维的第二纤维的熔化的优点相互束缚。 根据该载体，可以防止有助于微生物沉积的第一纤维的分离，并且可以借助于无纺织物f1来防止通过针刺的纤网的聚集，从而消除变化 重量。

公开(公告)号：WO1998009328A1

公开(公告)日：1998-03-05

申请号：PCT/JP1997002988

申请日：1997-08-27

Applicant: NIPPON STEEL CORPORATION ,  TATSUMI, Kohei ,  SHIMOKAWA, Kenji ,  HASHINO, Eiji

Inventor： NIPPON STEEL CORPORATION

IPC: H01L23/12

CPC classification number: H01L23/49582 ,  H01L21/4821 ,  H01L21/4846 ,  H01L2924/0002 ,  Y10T29/49142 ,  Y10T29/49144 ,  H01L2924/00

Abstract: Specific portions to be plated are easily selected and the plating material quantity is arbitrarily controlled with a high precision. After minute metal balls (24) are arranged in a via-hole part (22) of a TAB tape (21) and bonded or joined to it, the minute metal balls (24) are melted to coat a copper wiring (23) which is exposed from the via-hole part of the TAB tape (21) with different type of metal selectively. With this constitution, the specific portions of an electronic component board can be partially plated easily with a high precision.

Abstract translation: 容易选择要镀覆的特定部分，并且以高精度任意地控制电镀材料量。 在TAB带（21）的通孔部分（22）中配置微小金属球（24）并将其接合或接合之后，微小金属球（24）熔化以覆盖铜布线（23），铜线 从具有不同类型金属的TAB带（21）的通孔部分露出。 利用这种结构，电子部件板的特定部分可以以高精度容易地部分地镀覆。

公开(公告)号：WO1998009323A1

公开(公告)日：1998-03-05

申请号：PCT/JP1997002996

申请日：1997-08-28

Applicant: NIPPON STEEL CORPORATION ,  SHIMOKAWA, Kenji ,  TATSUMI, Kohei ,  HASHINO, Eiji ,  YAMAMOTO, Toshio ,  KIKUCHI, Toshiharu

Inventor： NIPPON STEEL CORPORATION

IPC: H01L21/60

CPC classification number: H01L21/6835 ,  H01L24/11 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099

Abstract: A method and device for forming bumps composed of very small metallic balls on electrodes of semiconductor chips, printed board, etc. A first invention is such that a vacuum chamber for vacuum clamping is divided into a plurality of divisions and the clamping/releasing are controlled for each division so as to prevent balls from being clamped to an array board in aggregates. Partition walls are provided in the vacuum chamber. A second invention is such that cut-off sections are provided in an edge portion of the array board so as to prevent bumps already formed from being pressed against the board again. A third invention is such that a bump forming device which hold only one ball is disclosed. A forth invention is such that bumps are formed at once on two or more diced semiconductor chips. A fifth invention is such that an optimum amount range of very small metallic balls are accurately supplied to a container. A sixth invention is such that two or more balls excessively arranged on one suction hole of the array board are reliably detected.

Abstract translation: 一种用于在半导体芯片，印刷电路板等的电极上形成由非常小的金属球构成的凸块的方法和装置。第一个发明是将真空夹紧的真空室分成多个分段，并且夹紧/释放被控制 对于每个部分，以防止球被聚集在阵列板上。 真空室内设有分隔壁。 第二发明是在阵列板的边缘部分设置切断部分，以防止已经形成的凸起再次被压在基板上。 第三发明是公开了仅保持一个球的凸块形成装置。 第四发明是在两个或多个切割的半导体芯片上一次形成凸块。 第五发明是将极小金属球的最佳量范围精确地供给到容器。 第六发明是能够可靠地检测出排列在阵列基板的一个吸孔上的两个以上的球。