Invention Application
WO9919906A3 METHOD AND APPARATUS FOR PACKAGING HIGH TEMPERATURE SOLID STATE ELECTRONIC DEVICES
审中-公开
用于包装高温固态电子器件的方法和装置
- Patent Title: METHOD AND APPARATUS FOR PACKAGING HIGH TEMPERATURE SOLID STATE ELECTRONIC DEVICES
- Patent Title (中): 用于包装高温固态电子器件的方法和装置
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Application No.: PCT/US9821295Application Date: 1998-10-08
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Publication No.: WO9919906A3Publication Date: 1999-09-16
- Inventor: PANKOVE JACQUES ISAAC
- Applicant: ASTRALUX INC
- Assignee: ASTRALUX INC
- Current Assignee: ASTRALUX INC
- Priority: US94811097 1997-10-09
- Main IPC: H01L21/58
- IPC: H01L21/58 ; H01L21/607 ; H01L31/0203 ; H01L21/00
Abstract:
A semiconductor-chip (11) is bonded to a chip-carrier substrate (12) by way of a gold-to-gold bonding interface. A vacuum chuck (63) is provided to physically hold the semiconductor-chip (11) in physical contact with the chip-carrier substrate (12) as static force (61), ultrasonic power, and an elevated temperature are applied to two mating gold surfaces that are formed by two continuous and physically mating gold layers. The bonded assembly is encased in potting ceramic, or the bonded assembly is encased in a housing that includes a transparent cover that enables use as an optoelectronic semiconductor device.
Information query
IPC分类:
