The ends (4) of a lead frame (1) which are situated on the side of the sensor element circumscribe a contact region (5) in which the planar sensor element (3) is arranged in the lead frame plane. The lead frame (1) is extrusion coated with a flat plastic housing (6) out of which the outer terminals (2) lead. A recess (7) provided in the housing (6) is perpendicular to the lead frame plane and encloses at least the contact region (5). This facilitates the assembly, in particular, of sensor elements (3) which are connected on two sides.