Invention Application
WO00025984A1 CHEMICAL MECHANICAL POLISHING A SUBSTRATE HAVING A FILLER LAYER AND A STOP LAYER
审中-公开
化学机械抛光具有填料层和停止层的基材
- Patent Title: CHEMICAL MECHANICAL POLISHING A SUBSTRATE HAVING A FILLER LAYER AND A STOP LAYER
- Patent Title (English): Chemical mechanical polishing a substrate having a filler layer and a stop layer
- Patent Title (中): 化学机械抛光具有填料层和停止层的基材
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Application No.: PCT/US1999/025183Application Date: 1999-10-26
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Publication No.: WO00025984A1Publication Date: 2000-05-11
- Main IPC: B24B37/04
- IPC: B24B37/04 ; H01L21/3105 ; H01L21/321 ; H01L21/768
Abstract:
A substrate (10) is chemical mechanical polished with a high-selectivity slurry until the stop layer (14) is at least partially exposed, and then the substrate (10) is polished with a low-selectivity slurry until the stop layer (14) is completely exposed.
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