Invention Application
WO01048820A1 SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR BARE CHIP MOUNTED BY FLIP-CHIP BONDING, AND BOARD MEMBER WITH THIN-FILM STRUCTURE CAPACITOR FOR SEMICONDUCTOR BARE CHIP MOUNTED BY FLIP-CHIP BONDING
审中-公开
半导体器件，包括通过片芯焊接安装的半导体芯片，以及具有薄膜结构电容器的板状元件，用于通过片芯焊接安装的半导体裸芯片
- Patent Title: SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR BARE CHIP MOUNTED BY FLIP-CHIP BONDING, AND BOARD MEMBER WITH THIN-FILM STRUCTURE CAPACITOR FOR SEMICONDUCTOR BARE CHIP MOUNTED BY FLIP-CHIP BONDING
- Patent Title (English): Semiconductor device including semiconductor bare chip mounted by flip-chip bonding, and board member with thin-film structure capacitor for semiconductor bare chip mounted by flip-chip bonding
- Patent Title (中): 半导体器件，包括通过片芯焊接安装的半导体芯片，以及具有薄膜结构电容器的板状元件，用于通过片芯焊接安装的半导体裸芯片
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Application No.: PCT/JP1999/007257Application Date: 1999-12-24
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Publication No.: WO01048820A1Publication Date: 2001-07-05
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/50 ; H01L23/64 ; H01L25/00 ; H01L23/36 ; H01L27/04
Abstract:
A semiconductor device includes a semiconductor bare chip and a board member with a thin-film structure capacitor. The semiconductor bare chip has a power supply terminal and a grounding terminal on the back thereof, and mounted on a circuit board by flip-chip bonding. The board member comprises a board and a thin-film structure capacitor provided on the board. The capacitor has terminals corresponding to the power supply terminal and grounding terminal of the semiconductor bare chip thereon. The side of the board member where the capacitor is provided is bonded to the back of the semiconductor bare chip. The terminals of the capacitor are electrically connected to the power supply terminal and grounding terminal of the semiconductor bare chip.
Information query
IPC分类:
