发明申请
- 专利标题： SEMICONDUCTOR ELEMENT AND METHOD FOR PRODUCING THE SAME
- 专利标题（中）： 半导体部件与方法研究
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申请号： PCT/DE0100702申请日： 2001-02-23
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公开(公告)号： WO0171799A3公开(公告)日： 2002-04-04
- 发明人: HEDLER HARRY , MEYER THORSTEN
- 申请人： INFINEON TECHNOLOGIES AG , HEDLER HARRY , MEYER THORSTEN
- 专利权人： INFINEON TECHNOLOGIES AG,HEDLER HARRY,MEYER THORSTEN
- 当前专利权人： INFINEON TECHNOLOGIES AG,HEDLER HARRY,MEYER THORSTEN
- 优先权： DE10014300 2000-03-23
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L21/60 ; H01L23/485
摘要：
The invention relates to a semiconductor element, comprising a semiconductor chip which has at least one contact pad on a first main side and a protective layer which does not cover the at least one contact pad. The semiconductor element can be connected to a substrate by means of flip-chip contacting. Bumps are provided on the first main side, said bumps being at least partially connected to the at least one contact pad by printed conductors provided on the protective layer. The raised parts can be produced either with printable materials or by multiple galvanisation of the printed conductor ends lying opposite the contact pads.
IPC分类:
