Invention Application
WO01090428A1 COPPER-BASED CONTACT MATERIAL, CONTACT SLUG AND PROCEDURE FOR MAKING THE CONTACT SLUG 审中-公开
基于铜的接触材料,接触层和制造接触层的程序

  • Patent Title: COPPER-BASED CONTACT MATERIAL, CONTACT SLUG AND PROCEDURE FOR MAKING THE CONTACT SLUG
  • Patent Title (中): 基于铜的接触材料,接触层和制造接触层的程序
  • Application No.: PCT/HU2001/000059
    Application Date: 2001-05-23
  • Publication No.: WO01090428A1
    Publication Date: 2001-11-29
  • Main IPC: C22C1/04
  • IPC: C22C1/04 C22C9/00 H01H1/025 H01H1/027 H01H1/02
COPPER-BASED CONTACT MATERIAL, CONTACT SLUG AND PROCEDURE FOR MAKING THE CONTACT SLUG
Abstract:
The object of the invention is a copper-based contact material containing the following components (mass percents): graphite 0,5-5,0 %, cadmium 0,1-0,5 %, 0,2-0,5 %, zirconium 0,2-0,5 %, indium 0,1-0,3 %, tantalum 0,05-0,2 %. Further aspects of the invention are a contact slug made of the above contact material prepared by powder metallurgical method, and a procedure for preparing contact slugs by powder metallurgical method, by which granules of 50 um size or smaller are prepared from the above defined composition, mixed and pressed into slugs with a typical specific pressure of 0,4 gPa, the slugs are then baked with the addition of graphite and cadmium-oxide at a temperature of 1223+/-10 K in a vacuum at alumina-spraying, the baked slugs are then re-pressed and sintered at a temperature of 723+/-10K.
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