Invention Application
- Patent Title: VIBRATION AND SHOCK RESISTANT HEAT SINK ASSEMBLY
- Patent Title (中): 振动和抗震散热器组件
-
Application No.: PCT/IB0101593Application Date: 2001-07-19
-
Publication No.: WO0215265A3Publication Date: 2003-03-13
- Inventor: WANG CHONG-SHENG
- Applicant: TYCO ELECTRONICS LOGISTICS AG
- Assignee: TYCO ELECTRONICS LOGISTICS AG
- Current Assignee: TYCO ELECTRONICS LOGISTICS AG
- Priority: US63741800 2000-08-11
- Main IPC: H01L23/40
- IPC: H01L23/40 ; H01L23/34
Abstract:
A vibration and shock resistant heat dissipating device (10) for removing heat from a heat generating object (12) is disclosed. The heat dissipating device (10) includes a retaining clip (22) having a central member (24) and a pair of legs (28) depending downwardly therefrom. An aperture (26) is disposed through the central member (24) and defines a central member bore having female threading formed therein. The free ends (30) of the pair of legs (28) are secured relative to the heat generating object (12). A heat dissipating member (11) having a threaded base portion (14) with a substantially flat bottom surface (16) is adapted to be threadably received in the center member bore (26) so that the flat bottom surface (16) of the heat dissipating member (11) is in flush thermal communication with the heat generating member (12). A ratchet member (20) is disposed between the retaining clip (22) and the heat dissipating member (11) for controlling threaded receipt of the threaded base portion (14) in the retaining clip (22). The ratchet member (20) permits only inward installation threading of the base portion (14) into the center member bore (26) while preventing threaded removal of the base portion (14) out from retaining clip (22). Use of a tool (200) enables threaded removal of the base portion (14) out from the retaining clip (22).
Information query
IPC分类: