Invention Application
- Patent Title: SUBSTRATE SUPPORTING CARRIER PAD
- Patent Title (中): 基板支撑载体垫
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Application No.: PCT/US0125964Application Date: 2001-08-20
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Publication No.: WO0216080A3Publication Date: 2002-06-20
- Inventor: OLIVER MICHAEL R
- Applicant: RODEL INC
- Assignee: RODEL INC
- Current Assignee: RODEL INC
- Priority: US22712800 2000-08-23
- Main IPC: B24B37/30
- IPC: B24B37/30 ; B24B41/06 ; B24B37/04
Abstract:
A carrier head assembly (200) of a substrate (202) polishing apparatus and a substrate supporting carrier pad (220) is disclosed. A down force is uniformly distributed over the backside of the substrate (202) by the carrier pad (220) adapted to be internally pressurized by the down force.
Public/Granted literature
- WO0216080A8 SUBSTRATE SUPPORTING CARRIER PAD Public/Granted day:2002-08-22
Information query
