A semiconductor package having a structure in which the surface of a semiconductor chip (30) is protected with a resin film (12) having a conductor wiring layer (11) and a method for manufacturing the semiconductor package. The surface of the semiconductor chip (30) and the resin film (12) are directly jointed by fusing the resin film (12), and a part of the conductor wiring layer (11) is connected with the electrode portion of the semiconductor chip (30) and another part of the conductor wiring layer (11) is exposed outside as an external terminal. The semiconductor package is highly reliable and excellent although it has a wireless/fine pitch and an extremely small thickness.