A method for forming an electrically isolated via in a multilayer ceramic package and an electrical connection formed within the via are disclosed. The method includes punching a first via (30) in a first layer (10), filling the first via with a cross-linkable paste (40), curing the paste to form an electrical insulator precursor and forming the via in the insulator precursor. The electrical connection formed includes an insulator made from a cross-linked paste supported by a substrate of a multilayer ceramic package and a conductive connection supported by the insulator.