Invention Application
- Patent Title: HIGH POWER RADIATION EMITTER DEVICE AND HEAT DISSIPATING PACKAGE FOR ELECTRONIC COMPONENTS
- Patent Title (中): 高功率辐射发射器件和电子元件的散热封装
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Application No.: PCT/US2002/003161Application Date: 2002-01-31
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Publication No.: WO2002061805A2Publication Date: 2002-08-08
- Inventor: ROBERTS, John, K. , REESE, Spencer, D.
- Applicant: GENTEX CORPORATION , ROBERTS, John, K. , REESE, Spencer, D.
- Applicant Address: 600 North Centennial Street, Zeeland, MI 49464 US
- Assignee: GENTEX CORPORATION,ROBERTS, John, K.,REESE, Spencer, D.
- Current Assignee: GENTEX CORPORATION,ROBERTS, John, K.,REESE, Spencer, D.
- Current Assignee Address: 600 North Centennial Street, Zeeland, MI 49464 US
- Agency: CARRIER, Robert, J.
- Priority: US60/265,487 20010131; US09/835,238 20010413
- Main IPC: H01L
- IPC: H01L
Abstract:
The electronic component package (10) of the present invention includes a sealed chamber; a liquid or gel (20) contained in the sealed chamber; at least one electronic component (12) disposed in the sealed chamber in physical and thermal contact with the liquid or gel (20); and at least one electrical conductor electrically coupled to the electronic component and extending out of the sealed chamber. The electronic component(s) (12) may include any one or combination of a radiation emitter, a thermal or optical sensor, a resistor, and a microprocessor or other semiconductor component.
Information query
