Invention Application
- Patent Title: CARD MANUFACTURING TECHNIQUE AND RESULTING CARD
- Patent Title (中): 卡制造技术和结果卡
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Application No.: PCT/US2002/024535Application Date: 2002-08-02
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Publication No.: WO2003015484A1Publication Date: 2003-02-20
- Inventor: WALLACE, Robert, F.
- Applicant: SANDISK CORPORATION
- Applicant Address: 140 Caspian Court, Sunnyvale, CA 94089 US
- Assignee: SANDISK CORPORATION
- Current Assignee: SANDISK CORPORATION
- Current Assignee Address: 140 Caspian Court, Sunnyvale, CA 94089 US
- Agency: PARSONS, Gerald, P.
- Priority: US09/921,664 20010803
- Main IPC: H05K1/11
- IPC: H05K1/11
Abstract:
A card manufacturing technique and the resulting card are provided. The card has a ground and/or power layer (112) extending to the edges of a circuit board for electrostatic discharge protection but also has gaps (112a) at the edge of the ground and/or power layer (112) to avoid short circuiting with conductive segments (160) of another layer deformed when the card is trimmed during manufacture.
Information query
