Invention Application
WO2005004199A3 COMPOSITIONS AND METHODS FOR HIGH-EFFICIENCY CLEANING/POLISHING OF SEMICONDUCTOR WAFERS
审中-公开
用于高效清洗/抛光半导体波形的组合物和方法
- Patent Title: COMPOSITIONS AND METHODS FOR HIGH-EFFICIENCY CLEANING/POLISHING OF SEMICONDUCTOR WAFERS
- Patent Title (中): 用于高效清洗/抛光半导体波形的组合物和方法
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Application No.: PCT/US2004019088Application Date: 2004-06-15
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Publication No.: WO2005004199A3Publication Date: 2006-08-10
- Inventor: KORZENSKI MICHAEL B , XU CHONGYING , BAUM THOMAS H , MINSEK DAVID , GHENCIU ELIODOR G
- Applicant: ADVANCED TECH MATERIALS , KORZENSKI MICHAEL B , XU CHONGYING , BAUM THOMAS H , MINSEK DAVID , GHENCIU ELIODOR G
- Assignee: ADVANCED TECH MATERIALS,KORZENSKI MICHAEL B,XU CHONGYING,BAUM THOMAS H,MINSEK DAVID,GHENCIU ELIODOR G
- Current Assignee: ADVANCED TECH MATERIALS,KORZENSKI MICHAEL B,XU CHONGYING,BAUM THOMAS H,MINSEK DAVID,GHENCIU ELIODOR G
- Priority: US60217203 2003-06-24
- Main IPC: C11D1/00
- IPC: C11D1/00 ; B08B3/04 ; B08B3/08 ; C11D3/30 ; C11D7/26 ; C11D7/28 ; C11D7/32 ; C11D7/50 ; C11D11/00 ; G03F7/42 ; H01L21/306 ; H01L21/311
Abstract:
A composition including supercritical fluid and at least one additive selected from fluoro species, and primary and/or secondary amines, optionally with co-solvent, low k material attack-inhibitor(s) and/or surfactant(s). The composition has particular utility for cleaning of semiconductor wafers to remove post-ashing residues therefrom.
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