Invention Application
- Patent Title: LOW LOOP HEIGHT BALL BONDING METHOD AND APPARATUS
- Patent Title (中): 低环高度球接法和装置
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Application No.: PCT/US2004/039676Application Date: 2004-11-24
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Publication No.: WO2005055282A2Publication Date: 2005-06-16
- Inventor: QIN, Ivy, W. , WISE, Robert
- Applicant: KULICKE & SOFFA INVESTMENTS, INC. , QIN, Ivy, W. , WISE, Robert
- Applicant Address: Little Falls Center Two, 2751 Centerville Road, Suite 3165, Wilmington, DE 19808 US
- Assignee: KULICKE & SOFFA INVESTMENTS, INC.,QIN, Ivy, W.,WISE, Robert
- Current Assignee: KULICKE & SOFFA INVESTMENTS, INC.,QIN, Ivy, W.,WISE, Robert
- Current Assignee Address: Little Falls Center Two, 2751 Centerville Road, Suite 3165, Wilmington, DE 19808 US
- Agency: NACCARELLA, Theodore
- Priority: US60/525,305 20031126; US10/988,053 20041112
- Main IPC: H01L
- IPC: H01L
Abstract:
In accordance with the invention, a bump is formed on top of a die bond pad by forming a ball bond there. Then, without severing the wire, the capillary undergoes a set of coordinated motions to fold the wire on top of the ball bond. The wire is then stich bonded on top of the ball bond bump without severing the wire. This is then followed by a further set of coordinated xy motions to form the loop and bring the capillary over the second bond site (e.g., on the lead frame). The wire is then stitch bonded to the second bond site and the tail severed to complete the wire loop interconnect.
Information query
