公开(公告)号：WO2005055282A2

公开(公告)日：2005-06-16

申请号：PCT/US2004/039676

申请日：2004-11-24

Applicant: KULICKE & SOFFA INVESTMENTS, INC. ,  QIN, Ivy, W. ,  WISE, Robert

Inventor： QIN, Ivy, W. ,  WISE, Robert

IPC: H01L

CPC classification number: H01L24/85 ,  B23K20/007 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/4846 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48599 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/859 ,  H01L2224/85986 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/20752 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: In accordance with the invention, a bump is formed on top of a die bond pad by forming a ball bond there. Then, without severing the wire, the capillary undergoes a set of coordinated motions to fold the wire on top of the ball bond. The wire is then stich bonded on top of the ball bond bump without severing the wire. This is then followed by a further set of coordinated xy motions to form the loop and bring the capillary over the second bond site (e.g., on the lead frame). The wire is then stitch bonded to the second bond site and the tail severed to complete the wire loop interconnect.

Abstract translation: 根据本发明，通过在那里形成球接头，在管芯接合焊盘的顶部形成凸点。 然后，在不断开电线的情况下，毛细管经历一组协调的运动，以将电线折叠在球接头顶部。 然后将导线焊接在球焊接凸块的顶部上，而不会断开导线。 然后再进行一组协调的xy运动以形成环并使毛细管穿过第二结合部位（例如，在引线框架上）。 然后将线缝合到第二接合位置，并且尾部切断以完成线环互连。

公开(公告)号：WO2005055282A3

公开(公告)日：2006-02-09

申请号：PCT/US2004039676

申请日：2004-11-24

Applicant: KULICKE & SOFFA INVESTMENTS ,  QIN IVY W ,  WISE ROBERT

Inventor： QIN IVY W ,  WISE ROBERT

IPC: B23K20/00 ,  B23K11/16 ,  B23K31/02 ,  B23K37/00

CPC classification number: H01L24/85 ,  B23K20/007 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/4846 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48599 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/859 ,  H01L2224/85986 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/20752 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/4554

Abstract: In accordance with the invention, a bump is formed on top of a die bond pad by forming a ball bond there. Then, without severing the wire, the capillary undergoes a set of coordinated motions to fold the wire on top of the ball bond. The wire is then stich bonded on top of the ball bond bump without severing the wire. This is then followed by a further set of coordinated xy motions to form the loop and bring the capillary over the second bond site (e.g., on the lead frame). The wire is then stitch bonded to the second bond site and the tail severed to complete the wire loop interconnect.

Abstract translation: 根据本发明，通过在那里形成球接头，在管芯接合焊盘的顶部形成凸点。 然后，在不断开电线的情况下，毛细管经历一组协调的运动，以将电线折叠在球接头顶部。 然后将导线焊接在球焊接凸块的顶部上，而不会断开导线。 然后再进行一组协调的xy运动以形成环并使毛细管穿过第二结合部位（例如，在引线框架上）。 然后将线缝合到第二接合位置，并且尾部切断以完成线环互连。