Invention Application
WO2005087497A3 3D-INK JET STRUCTURING OF HIGHLY TOPOGRAPHIC SURFACES
审中-公开
三维喷墨结构HOCHTOPOGRAFISCHEN SURFACES
- Patent Title: 3D-INK JET STRUCTURING OF HIGHLY TOPOGRAPHIC SURFACES
- Patent Title (中): 三维喷墨结构HOCHTOPOGRAFISCHEN SURFACES
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Application No.: PCT/EP2005051053Application Date: 2005-03-09
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Publication No.: WO2005087497A3Publication Date: 2006-05-04
- Inventor: KASPER MICHAEL , REBHAN MATTHIAS , WEIDNER KARL , WEINKE ROBERT
- Applicant: SIEMENS AG , KASPER MICHAEL , REBHAN MATTHIAS , WEIDNER KARL , WEINKE ROBERT
- Assignee: SIEMENS AG,KASPER MICHAEL,REBHAN MATTHIAS,WEIDNER KARL,WEINKE ROBERT
- Current Assignee: SIEMENS AG,KASPER MICHAEL,REBHAN MATTHIAS,WEIDNER KARL,WEINKE ROBERT
- Priority: DE102004012251 2004-03-12
- Main IPC: B41F17/24
- IPC: B41F17/24 ; B41M20060101 ; H01L51/00 ; H05K1/00 ; H05K3/00 ; H05K3/10 ; H05K3/12 ; H05K3/24 ; B41M3/00 ; B41J2/07 ; H01L51/40
Abstract:
The highly topographic surface (2) of an electronic component (1) is provided with a layer (8) in an ink jet printing process during which some areas (10) are subjected to an intensified printing.
Information query
