Invention Application
- Patent Title: SELECTIVE BONDING FOR FORMING A MICROVALVE
- Patent Title (中): 选择性粘结形成微孔
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Application No.: PCT/US2005004821Application Date: 2005-02-15
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Publication No.: WO2005091820A3Publication Date: 2006-10-26
- Inventor: DAVIES BRADY REUBEN
- Applicant: ALUMINA MICRO LLC , DAVIES BRADY REUBEN
- Assignee: ALUMINA MICRO LLC,DAVIES BRADY REUBEN
- Current Assignee: ALUMINA MICRO LLC,DAVIES BRADY REUBEN
- Priority: US55065304 2004-03-05
- Main IPC: A63B37/02
- IPC: A63B37/02 ; A63B39/00 ; B29C65/00 ; B29C65/02 ; B29C65/48 ; B32B5/02 ; B32B37/00 ; B32B38/04
Abstract:
A method for forming a microvalve is disclosed. The method includes providing a first silicon layer (12) and a second silicon layer (14), etching the second silicon layer to form a slider portion (40), coating a coating material onto the slider portion (40), bonding the first silicon layer (12) to the second silicon layer (14), wherein the coating material separates the slider portion (40) from the first silicon layer (12) and prevent the slider portion (40) from bonding to the first silicon layer (12).
Information query
