Method for manufacturing an electronic module, which electronic module includes a component (6) , which is connected electrically to a conductor-pattern layer (14) . In the method contact openings (17) are made in the conductor layer (4) , the mutual positions of which correspond to the mutual positions of the contact areas (7) of the component (6) . After this, the component (6) and the conductor layer (4) are aligned relative to each other, in such a way that the contact areas (7) of the component (6) come to the positions of the contact openings (17) , and the component (6) is secured. After this, at least in the contact openings (17) and the contact areas (7) of the component (6) a conductor material is provided that connects the component (6) to the conductor layer (4) . After the making of the contact the conductor layer (4) is patterned to form a conductor-pattern layer (14) .