公开(公告)号：WO2010133767A1

公开(公告)日：2010-11-25

申请号：PCT/FI2010/050403

申请日：2010-05-19

Applicant: IMBERA ELECTRONICS OY ,  KIVIKERO, Antti ,  KOSTENSALO, Pekka ,  MOISALA, Jaakko

Inventor： KIVIKERO, Antti ,  KOSTENSALO, Pekka ,  MOISALA, Jaakko

IPC: H01L23/31 ,  H01L23/538

CPC classification number: H05K1/18 ,  H01L21/4821 ,  H01L23/3114 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/19 ,  H01L24/20 ,  H01L24/31 ,  H01L24/83 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/92144 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/01022

Abstract: Disclosed is an electronic module with high routing efficiency and other new possibilities in conductor design. The electronic module comprises a wiring layer (3), a component (1) having a surface with contact terminals (2) and first contact elements (6) that connect at least some of the contact terminals (2) to the wiring layer (3). The electronic module is provided with at least one conducting pattern (4) on the surface of the component (1) but spaced apart from the contact terminals (2). The electronic module further comprises a dielectric (5) and at least one second contact element (7) that connects the conducting pattern (4) to the wiring layer (3) through a portion of said dielectric (5). Methods of manufacturing such modules are also disclosed.

Abstract translation: 公开了具有高布线效率和导体设计中的其他新可能性的电子模块。 电子模块包括布线层（3），具有接触端子（2）的表面的部件（1）和将至少一些接触端子（2）连接到布线层（3）的第一接触元件（6） ）。 电子模块在组件（1）的表面上设置有至少一个导电图案（4），但与接触端子（2）间隔开。 电子模块还包括通过所述电介质（5）的一部分将导电图案（4）连接到布线层（3）的电介质（5）和至少一个第二接触元件（7）。 还公开了制造这种模块的方法。

公开(公告)号：WO2006056648A2

公开(公告)日：2006-06-01

申请号：PCT/FI2005/000506

申请日：2005-11-24

Applicant: IMBERA ELECTRONICS OY ,  TUOMINEN, Risto ,  IIHOLA, Antti

Inventor： TUOMINEN, Risto ,  IIHOLA, Antti

IPC: H05K1/18 ,  H01L23/538 ,  H01L23/12

CPC classification number: H01L25/50 ,  H01L23/5389 ,  H01L24/19 ,  H01L25/0657 ,  H01L2223/54426 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/20 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/92144 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/185 ,  H05K1/188 ,  H05K2201/10515 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/2804 ,  H01L2924/00

Abstract: This publication discloses an electronics module and a method for manufacturing it. The electronic module includes at least one first embedded component (6), the contact terminals (7) of which face essentially towards the first surface of the insulating- material layer (1) and which is connected electrically by its contact terminals (7) to the conductor structures contained in the electronic module. According to the invention, a second embedded component (6'), the contact terminals (7') of which face essentially towards the second surface of the insulating- material layer and which is connected electrically by its contact terminals (7') to the conductor structures contained in the electronic module, is attached to the first component (6), and the contact terminals (7, 7') are connected to the conductor structures with the aid of a conductive material, which is arranged in the insulating-material layer in holes (17) at the locations of the contact terminals (7, 7'). By means of the invention, it is possible to achieve a simple module construction comprising two component layers, which permits the manufacture of smaller electronic devices than previously.

Abstract translation: 该出版物公开了一种电子模块及其制造方法。 电子模块包括至少一个第一嵌入式部件（6），其接触端子（7）基本上朝向绝缘材料层（1）的第一表面，并且由其接触端子（7）电连接到 导体结构包含在电子模块中。 根据本发明，第二嵌入式部件（6'），其接触端子（7'）基本上朝向绝缘材料层的第二表面，并且其接触端子（7'）电连接到绝缘材料层 包含在电子模块中的导体结构附接到第一部件（6），并且接触端子（7,7'）借助导电材料连接到导体结构，导电材料布置在绝缘材料 在接触端子（7,7'）的位置处的孔（17）中的层。 通过本发明，可以实现包括两个组件层的简单的模块结构，这允许制造比以前更小的电子设备。

公开(公告)号：WO2005104636A1

公开(公告)日：2005-11-03

申请号：PCT/FI2005/000200

申请日：2005-04-27

Applicant: IMBERA ELECTRONICS OY ,  TUOMINEN, Risto ,  IIHOLA, Antti

Inventor： TUOMINEN, Risto ,  IIHOLA, Antti

IPC: H05K1/18

CPC classification number: H01L23/5389 ,  H01L23/3677 ,  H01L24/25 ,  H01L24/82 ,  H01L25/0652 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/18 ,  H01L2224/2518 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H05K1/0206 ,  H05K1/188 ,  H05K3/4046 ,  H05K3/4611 ,  Y10T29/49128 ,  Y10T29/49139 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49218 ,  H01L2924/00

Abstract: This publication discloses an electronics module and a method for manufacturing it. The electronics module includes at least one component (6) embedded in an insulating-material layer (1), which has a first contacting surface, in which there are first contact terminals (7), from which the component (6) is connected electrically to the conductor structures contained in the electronics module. In addition, the component (6) has a second contacting surface opposite to the first contacting surface, in which there is at least one second contact terminal (7’), from which the component (6) is connected electrically to the conductor structures contained in the electronics module. With the aid of the invention, it is possible to achieve an electronic-module construction that saves space compared to the prior art.

Abstract translation: 该出版物公开了一种电子模块及其制造方法。 电子模块包括嵌入在绝缘材料层（1）中的至少一个部件（6），其具有第一接触表面，其中存在第一接触端子（7），部件（6）从该第一接触表面电连接 到电子模块中包含的导体结构。 另外，部件（6）具有与第一接触表面相对的第二接触表面，其中存在至少一个第二接触端子（7'），部件（6）从该接触端子电连接到包含的导体结构 在电子模块中。 借助于本发明，可以实现与现有技术相比节省空间的电子模块结构。

公开(公告)号：WO2009138560A1

公开(公告)日：2009-11-19

申请号：PCT/FI2009/050383

申请日：2009-05-11

Applicant: IMBERA ELECTRONICS OY ,  PALM, Petteri ,  TUOMINEN, Risto ,  IIHOLA, Antti

Inventor： PALM, Petteri ,  TUOMINEN, Risto ,  IIHOLA, Antti

IPC: H01L21/60 ,  H01L23/538

CPC classification number: H05K1/09 ,  H01L21/486 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L2221/68359 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/32245 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/351 ,  H05K1/182 ,  H05K1/188 ,  H05K3/305 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/0969 ,  H05K2201/10674 ,  H05K2203/063 ,  Y10T29/49117 ,  Y10T29/4913 ,  H01L2924/00

Abstract: Manufacturing method and circuit module, which comprises an insulator layer (1) and, inside the insulator layer (1), at least one component (6), which comprises contact areas (7), the material of which contains a first metal. On the surface of the insulator layer (1) are conductors (22), which comprise at least a first layer (12) and a second layer (32), in such a way that at least the second layer (32) contains a second metal. The circuit module comprises contact elements between the contact areas (7) and the conductors (22) for forming electrical contacts. The contact elements, for their part, comprise, on the surface of the material of the contact area (7), an intermediate layer (2), which contains a third metal, in such a way that the first, second, and third metals are different metals and the contact surface area (A CONT1) , between the intermediate layer (2) and the contact area (7) is less that the surface area (APAD) of the contact area (7).

Abstract translation: 制造方法和电路模块包括绝缘体层（1）和绝缘体层（1）内部的至少一个部件（6），其包括接触区域（7），其材料包含第一金属。 在绝缘体层（1）的表面上是包括至少第一层（12）和第二层（32）的导体（22），至少第二层（32）包含第二层 金属。 电路模块包括接触区域（7）和用于形成电触点的导体（22）之间的接触元件。 接触元件在其接触区域（7）的材料的表面上包括含有第三金属的中间层（2），使得第一，第二和第三金属 是不同的金属，中间层（2）和接触区域（7）之间的接触表面积（ACONT1）小于接触区域（7）的表面积（APAD）。

公开(公告)号：WO2005027602A1

公开(公告)日：2005-03-24

申请号：PCT/FI2004/000538

申请日：2004-09-15

Applicant: IMBERA ELECTRONICS OY ,  IIHOLA, Antti ,  JOKELA, Timo

Inventor： IIHOLA, Antti ,  JOKELA, Timo

IPC: H05K3/32

CPC classification number: H05K1/188 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/24227 ,  H01L2224/82039 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H05K3/4602 ,  H05K3/4611 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0394 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49156 ,  H01L2924/00

Abstract: This publication discloses a method for manufacturing an electronic module, in which manufacture commences from an insulating-material sheet (1). At least one recess (2) is made in the sheet (1) and extends through the insulating-material layer (1) as far as the conductive layer on the opposite surface (1 a). A component (6) is set in the recess, with its contact surface towards the conductive layer and the component (6) is attached to the conductive layer. After this, a conductive pattern (14) is formed from the conductive pattern closing the recess, which is electrically connected from at least some of the contact areas or contact protrusions of the component (6) set in the recess.

Abstract translation: 该出版物公开了一种制造电子模块的方法，其中制造从绝缘材料片（1）开始。 在片材（1）中形成至少一个凹部（2），并延伸穿过绝缘材料层（1）至相对表面（1a）上的导电层。 将部件（6）设置在凹部中，其接触表面朝向导电层，并且部件（6）附接到导电层。 之后，从导电图案形成导电图案（14），所述导电图案封闭凹部，所述导电图案与设置在凹部中的部件（6）的至少一些接触区域或接触突起电连接。

公开(公告)号：WO2004089048A1

公开(公告)日：2004-10-14

申请号：PCT/FI2004/000195

申请日：2004-03-31

Applicant: IMBERA ELECTRONICS OY ,  TUOMINEN, Risto ,  PALM, Petteri

Inventor： TUOMINEN, Risto ,  PALM, Petteri

IPC: H05K1/18

CPC classification number: H01L23/544 ,  H01L23/5389 ,  H01L24/19 ,  H01L25/0652 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/32245 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/3025 ,  H05K1/188 ,  H05K3/4611 ,  H01L2924/00

Abstract: This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component (6) is glued (5) to the surface of a conductive layer, from which conductive layer conductive patterns (14) are later formed. After gluing the component (6), an insulating-material layer (1), which surrounds the component (6) attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After the gluing of the component (6), feed-throughs are also made, through which electrical contacts can be made between the conductive layer and the contact zones (7) of the component. After this, conductive patterns (14) are made from the conductive layer, to the surface of which the component (6) is glued.

Abstract translation: 该出版物公开了一种用于制造电子模块的电子模块和方法，其中将组件（6）胶合（5）到导电层的表面，稍后形成导电层导电图案（14）。 在粘合组分（6）之后，在导电层的表面上形成或附着到导电层上的附着于导电层的组分（6）的绝缘材料层（1）。 在组件（6）的胶合之后，还制成馈通，通过该导通可以在导电层和部件的接触区域（7）之间形成电接触。 此后，导电图案（14）由导电层制成，其表面部件（6）被胶合。

公开(公告)号：WO2003065778A1

公开(公告)日：2003-08-07

申请号：PCT/FI2003/000064

申请日：2003-01-28

Applicant: IMBERA ELECTRONICS OY ,  TUOMINEN, Risto

Inventor： TUOMINEN, Risto

IPC: H05K1/18

CPC classification number: H05K1/185 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/82039 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00

Abstract: This publication discloses a method, in which the semiconductor components forming part of an electronic circuit, or at least some of them, are embedded in a base, such as a circuit board, during the manufacture of the base. Thus, the base structure is more or less manufactured around the semiconductor component. According to the invention, first of all at least one conductive pattern and through holes for the semiconductor components are made in the base, After this, the semiconductor components are placed in the holes in alignment with the conductive pattern. The semiconductor components are attached to the structure of the base and one or more conductive pattern layers are made in the base in such a way that at least one conductive pattern forms an electrical contact with the contact areas of the surface of the semiconductor component.

Abstract translation: 本公开公开了一种方法，其中形成电子电路的一部分的半导体部件或其至少一部分的半导体部件在基座的制造期间嵌入在诸如电路板的基座中。 因此，基本结构或多或少围绕半导体部件制造。 根据本发明，首先在基底中形成至少一个导电图案和用于半导体部件的通孔，之后，将半导体部件放置在与导电图案对准的孔中。 半导体部件附接到基底的结构，并且在基底中制造一个或多个导电图案层，使得至少一个导电图案与半导体部件的表面的接触区域形成电接触。

公开(公告)号：WO2006134216A3

公开(公告)日：2007-07-05

申请号：PCT/FI2006000207

申请日：2006-06-15

Applicant: IMBERA ELECTRONICS OY ,  TUOMINEN RISTO ,  IIHOLA ANTTI ,  PALM PETTERI

Inventor： TUOMINEN RISTO ,  IIHOLA ANTTI ,  PALM PETTERI

IPC: H05K3/20 ,  H01L21/48 ,  H01L21/60 ,  H01L23/13 ,  H01L23/538 ,  H01L23/544 ,  H05K20060101 ,  H05K1/18 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32 ,  H05K3/40

CPC classification number: H05K3/064 ,  H01L21/4846 ,  H01L21/56 ,  H01L23/13 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/16 ,  H01L24/24 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/90 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/16 ,  H01L2224/18 ,  H01L2224/24227 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81121 ,  H01L2224/81132 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/82039 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2224/92144 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/183 ,  H05K1/187 ,  H05K1/188 ,  H05K3/205 ,  H05K3/284 ,  H05K3/303 ,  H05K3/305 ,  H05K3/32 ,  H05K3/321 ,  H05K3/4069 ,  H05K2201/0355 ,  H05K2201/09563 ,  H05K2201/0969 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0353 ,  H05K2203/063 ,  H05K2203/0723 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2224/29075 ,  H01L2924/00 ,  H01L2224/0401

Abstract: The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil (2) and a conductor pattern (6) on the surface of the conductor foil. A component (9) is attached to the conductor layer and the conductor layer is thinned, in such a way that the conductor material of the conductor layer is removed from outside the conductor pattern (6).

Abstract translation: 本公开公开了一种制造电路板结构的方法。 在该方法中，制造导体层，其在导体箔的表面上包括导体箔（2）和导体图案（6）。 将部件（9）附接到导体层并且导体层变薄，使得导体层的导体材料从导体图案（6）的外部移除。

公开(公告)号：WO2006134217A1

公开(公告)日：2006-12-21

申请号：PCT/FI2006/000208

申请日：2006-06-15

Applicant: IMBERA ELECTRONICS OY ,  TUOMINEN, Risto ,  IIHOLA, Antti ,  PALM, Petteri

Inventor： TUOMINEN, Risto ,  IIHOLA, Antti ,  PALM, Petteri

IPC: H05K1/00 ,  H05K1/11 ,  H05K3/42 ,  H05K3/46

CPC classification number: H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H05K1/183 ,  H05K1/186 ,  H05K1/187 ,  H05K3/0017 ,  H05K3/20 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/423 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2201/10674 ,  H05K2203/0554 ,  H05K2203/0733 ,  H05K2203/1438 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49158 ,  H01L2924/00

Abstract: This publication discloses a method for manufacturing a circuit-board structure. According to the method, a conductor pattern (13) is made, and contact openings are made in it for a component's (16) electrical contacts. After this, the component (16) is attached relative to the conductor pattern (13), in such a way that the contact areas or contact bumps of the component lie next to the contact openings. After this, an electrically conductive material is introduced to the contact openings, in order to form electrical contacts between the conductor pattern (13) and the component (16).

Abstract translation: 该出版物公开了一种制造电路板结构的方法。 根据该方法，制成导体图案（13），并且在其中形成用于组件（16）电触点的接触开口。 之后，组件（16）相对于导体图案（13）被附接，使得部件的接触区域或接触凸块靠近接触开口。 之后，将导电材料引入到接触开口中，以便在导体图案（13）和部件（16）之间形成电接触。

公开(公告)号：WO2006056643A2

公开(公告)日：2006-06-01

申请号：PCT/FI2005000499

申请日：2005-11-23

Applicant: IMBERA ELECTRONICS OY ,  TUOMINEN RISTO ,  IIHOLA ANTTI

Inventor： TUOMINEN RISTO ,  IIHOLA ANTTI

IPC: H01L23/538 ,  H01L20060101 ,  H01L21/48 ,  H01L21/60 ,  H01L21/68 ,  H01L23/498 ,  H05K1/18 ,  H05K3/42

CPC classification number: H05K1/188 ,  H01L21/4846 ,  H01L21/6835 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83132 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/3511 ,  H05K3/42 ,  H05K2201/0355 ,  H05K2201/10674 ,  Y10T29/49002 ,  Y10T29/49126 ,  H01L2924/00

Abstract: Method for manufacturing an electronic module, which electronic module includes a component (6), which has contact areas (17), which are connected electrically to a conductor- pattern layer (14). The manufacture according to the method starts from a layered membrane, which comprises at least a conductor layer (4) and an insulator layer (10) on the first surface of the conductor layer (4). Contact openings (17), the mutual positions of which correspond to the mutual positions of the contact areas (7) of the component (6), and which penetrate both the conductor layer (4) and the insulator layer (10), are made in the membrane. After the manufacture of the contact openings (17), the component (6) is attached to the surface of the insulator layer (10), in such a way that the contact areas (7) of the component (6) line up next to the contact openings (17). After this, at least in the contact openings (17) and the contact areas (7) of the component (6) a conductor material is made, which connects the component (6) to the conductor layer (4) and the conductor layer (4) is patterned to form a conductor-pattern layer (14).

Abstract translation: 用于制造电子模块的方法，该电子模块包括具有与导体图案层（14）电连接的接触区域（17）的部件（6）。 根据该方法的制造从层状膜开始，该层状膜在导体层（4）的第一表面上包括至少导体层（4）和绝缘体层（10）。 制造与元件（6）的接触区域（7）的相互位置相对应并且穿透导体层（4）和绝缘体层（10）两者的接触开口（17） 在膜中。 在制造接触开口（17）之后，将部件（6）附接到绝缘体层（10）的表面，使得部件（6）的接触区域（7）紧挨着 接触开口（17）。 此后，至少在部件（6）的接触开口（17）和接触区域（7）中制造导体材料，其将部件（6）连接到导体层（4）和导体层 4）被图案化以形成导体图案层（14）。