A field effect transistor (100) and method of fabricating the field effect transistor. The field effect transistor, including: a gate electrode (165) formed on a top surface (170) of a gate dielectric layer (155), the gate dielectric layer on a top surface (160) of a single-crystal silicon channel region (110), the single-crystal silicon channel region on a top surface of a Ge including layer (135), the Ge including layer on a top surface of a single-crystal silicon substrate (150), the Ge including layer between a first dielectric layer (215A) and a second dielectric layer (215B) on the top surface of the single-crystal silicon substrate.