发明申请
WO2007023327A1 MAGNETICALLY ALIGNABLE SEMICONDUCTOR CHIP AND REWIRING SUBSTRATE AND A METHOD FOR MAGNETICALLY ALIGNING THE SEMICONDUCTOR CHIP AND THE REWIRING SUBSTRATE
审中-公开
磁性可分离的半导体芯片和复原基板以及用于磁性地对准半导体芯片和重新接线的基板的方法
- 专利标题： MAGNETICALLY ALIGNABLE SEMICONDUCTOR CHIP AND REWIRING SUBSTRATE AND A METHOD FOR MAGNETICALLY ALIGNING THE SEMICONDUCTOR CHIP AND THE REWIRING SUBSTRATE
- 专利标题（中）： 磁性可分离的半导体芯片和复原基板以及用于磁性地对准半导体芯片和重新接线的基板的方法
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申请号： PCT/IB2005/002513申请日： 2005-08-24
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公开(公告)号： WO2007023327A1公开(公告)日： 2007-03-01
- 发明人: TAN, Ai Min , OFNER, Gerald , YEO, Swain Hong , TEO, Mary , LIM, Pei Siang
- 申请人： INFINEON TECHNOLOGIES AG , TAN, Ai Min , OFNER, Gerald , YEO, Swain Hong , TEO, Mary , LIM, Pei Siang
- 申请人地址： St.-Martin-Str. 53, 81669 München DE
- 专利权人： INFINEON TECHNOLOGIES AG,TAN, Ai Min,OFNER, Gerald,YEO, Swain Hong,TEO, Mary,LIM, Pei Siang
- 当前专利权人： INFINEON TECHNOLOGIES AG,TAN, Ai Min,OFNER, Gerald,YEO, Swain Hong,TEO, Mary,LIM, Pei Siang
- 当前专利权人地址： St.-Martin-Str. 53, 81669 München DE
- 代理机构： REITER, Andrea
- 主分类号： H01L21/60
- IPC分类号： H01L21/60
摘要：
A semiconductor chip (2) comprises at least one first alignment means (7). The first alignment means (7) comprises an electrically conductive inductor (24; 26) for magnetically aligning the semiconductor chip with a rewiring substrate of a semiconductor package. The rewiring substrate (3) includes at least one second alignment means (13) for magnetically aligning the rewiring substrate with a semiconductor chip of a semiconductor package. The second alignment means is disposed underneath an alignment contact pad (14).
IPC分类:
