Invention Application
- Patent Title: AN ELECTRONICS PACKAGE WITH AN INTEGRATED CIRCUIT DEVICE HAVING POST WAFER FABRICATION INTEGRATED PASSIVE COMPONENTS
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Application No.: PCT/US2007/070612Application Date: 2007-06-07
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Publication No.: WO2008008581A3Publication Date: 2008-01-17
- Inventor: LAM, Ken, M.
- Applicant: ATMEL CORPORATION , LAM, Ken, M.
- Applicant Address: 2325 Orchard Parkway San Jose, CA 95131 US
- Assignee: ATMEL CORPORATION,LAM, Ken, M.
- Current Assignee: ATMEL CORPORATION,LAM, Ken, M.
- Current Assignee Address: 2325 Orchard Parkway San Jose, CA 95131 US
- Agency: STEFFEY, Charles, E. et al.
- Priority: US11/456,685 20060711
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L23/34 ; H01L21/44 ; H01L21/8222
Abstract:
An apparatus and a method for producing passive components on an integrated circuit device (100). The integrated circuit device (100) has post wafer fabrication integrated passive components (107) situated on the opposite substrate side (105) of the device's integrated circuitry (103). Electrical contact pads (109) of the passive components (107) are configured to be coupled to the electronics package contact pads to complete the electronic package.
Information query
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