A method comprises providing a first electrically-conductive circuit-path (22), and separately providing a second electrically-conductive circuit-path (24). A portion of the first circuit-path is positioned proximally adjacent a portion of the second circuit-path at a first predetermined electrical bond location (26). A first, electrically-insulating barrier layer (28) is interposed between the first circuit-path and second circuit-path at the first bond location, and the first circuit-path is mechanically bonded to the second circuit-path at the first bond location. The mechanical bonding configured to provide an electrically-conductive bond-path between the first circuit-path and the second circuit-path at the first bond location. The mechanical bonding may desirably include ultrasonic bonding and/or pressure bonding.