Invention Application
- Patent Title: BUFFER LAYER FOR STRINGS
- Patent Title (中): 缓冲层
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Application No.: PCT/US2007084973Application Date: 2007-11-16
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Publication No.: WO2008061229A9Publication Date: 2008-08-21
- Inventor: YANIV ZVI , LI YUNJUN , MAO DONGSHENG
- Applicant: NANO PROPRIETARY INC , YANIV ZVI , LI YUNJUN , MAO DONGSHENG
- Assignee: NANO PROPRIETARY INC,YANIV ZVI,LI YUNJUN,MAO DONGSHENG
- Current Assignee: NANO PROPRIETARY INC,YANIV ZVI,LI YUNJUN,MAO DONGSHENG
- Priority: US86619906 2006-11-16
- Main IPC: A63B51/02
- IPC: A63B51/02 ; D02G3/44 ; D07B1/02 ; G10D3/10
Abstract:
A thin buffer layer (303) is used to coat on the multi-filament (401) wrapped string to fill the gaps. The polymers of the buffer-layer coating have a high melt-flow (low viscosity) during coating process to fill all the gaps between the filaments, and the filaments are fixed by the coatings onto base core materials.
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