A semiconductor package inspecting system includes a loading unit, a first vision inspection unit for visually inspecting a first surface of the semiconductor package, a second vision inspection unit for two-dimensionally inspecting a second surface of the semiconductor package using a color camera, a tray transfer device for transferring, a third vision inspection unit for two-dimensionally inspecting the second surface of the semiconductor package using a line scan camera, an unloading unit for allowing a tray having good-quality semiconductor devices received therein to be stacked therein, a fourth vision inspection unit for two-dimensionally inspecting the first surface of the semiconductor package using a line scan camera, a inverting device for transferring the tray, a reject unit for sorting and receiving defective semiconductor devices, and a sorting device for sorting the visually inspected semiconductor packages.