Abstract:
An apparatus for inspection of semiconductor device and method for inspection by the same are disclosed. The apparatus for inspection of semiconductor device includes air cleaners and a brush cleaner to automatically remove contaminants present on the exterior of the semiconductor devices, prior to performing vision inspections using the vision inspecting device, thereby reducing the number of semiconductor devices which have been determined to be defective due to contaminants, and consequently, improving a yield of semiconductor devices.
Abstract:
A method and apparatus for measuring the three-dimensional surface shape of an object using color informations of light reflected by the object. The method ans apparatus for measuring the three-dimensional surface shape of the object, in which a real-time measurement of the three-dimensional surface is performed by projecting a beam of light having color information onto the object and detecting color distributin information according to levels of the object, thereby obtaining level information of the object.
Abstract:
Disclosed is a method for inspecting a flat panel. The method for inspecting the flat panel includes the steps of: arranging a camera at a measurement location of the flat panel by horizontally moving at least one of the flat panel and the camera; automatically focusing the camera with respect to a measuring target of the flat panel at the measurement location; acquiring a plurality of images for the measuring target by vertically moving the camera within a set region on the basis of the present location of the camera when focusing the camera; selecting the image having the most definition for the measuring target among the acquired images; processing the selected image; and determining whether the measuring target is defective or not.
Abstract:
The three-dimensional shape measuring apparatus includes a light source; a beam splitter to split illumination light from the light source; a target object to be measured, having a height difference between the highest point and the lowest point; a reference mirror, on which another beam emitted from the beam splitter is irradiated; a light detecting element to detect an interference pattern generated by the interference of an object beam reflected by the surface of the target object and a reference beam reflected by the surface of the reference mirror; and a control computer to process an image detected by the light detecting element, wherein a subsidiary reference beam generating unit to change the optical path of the beam from the beam splitter to generate a subsidiary reference beam is provided between the beam splitter and the reference mirror.
Abstract:
The three-dimensional shape measuring apparatus includes a light source; a beam splitter to split illumination light from the light source; a target object to be measured, having a height difference between the highest point and the lowest point; a reference mirror, on which another beam emitted from the beam splitter is irradiated; a light detecting element to detect an interference pattern generated by the interference of an object beam reflected by the surface of the target object and a reference beam reflected by the surface of the reference mirror; and a control computer to process an image detected by the light detecting element, wherein a subsidiary reference beam generating unit to change the optical path of the beam from the beam splitter to generate a subsidiary reference beam is provided between the beam splitter and the reference mirror.
Abstract:
A semiconductor package inspecting system includes a loading unit, a first vision inspection unit for visually inspecting a first surface of the semiconductor package, a second vision inspection unit for two-dimensionally inspecting a second surface of the semiconductor package using a color camera, a tray transfer device for transferring, a third vision inspection unit for two-dimensionally inspecting the second surface of the semiconductor package using a line scan camera, an unloading unit for allowing a tray having good-quality semiconductor devices received therein to be stacked therein, a fourth vision inspection unit for two-dimensionally inspecting the first surface of the semiconductor package using a line scan camera, a inverting device for transferring the tray, a reject unit for sorting and receiving defective semiconductor devices, and a sorting device for sorting the visually inspected semiconductor packages.
Abstract:
An image measuring apparatus for acquiring an image captured by an optical system and a method thereof are disclosed. The apparatus includes a CCD camera for capturing the object and outputting the captured image, a lamp for generating light to illuminate a capturing area of the object, an illumination controller for controlling the lamp to be turned on, a projection grating formed with gratings, a projection grating driving unit for adjusting a distance between the projection grating and the object, an image capturing device for acquiring the image captured by the CCD camera, a driving signal generator for outputting a driving signal to the illumination controller, the projection grating driving unit, and the image capturing unit simultaneously according to an enable signal generated from the CCD camera, and an image signal processor for estimating a three-dimensional image of the object from data transmitted from the image capturing unit.
Abstract:
An apparatus and method for capturing picked-up images at a high speed.The apparatus includes a CCD (Charge Coupled Device) camera for picking up images of an object placed at a pickup area and outputting the picked-up images; a synchronous signal generator for generating an illumination control signal every time a frame enable signal outputted from the CCD camera is detected; an illumination controller for controlling an operation of turning on light sources surrounding the pickup area at different positions in response to the illumination control signal; and an image capture unit for capturing an image outputted from the CCD camera every time the frame enable signal is detected, and transmitting the captured image to an image signal processor.
Abstract:
The surface shape measuring system includes an illumination unit including a main light source, a focusing lens, and a projection lens; a beam splitter to split illumination light emitted respectively irradiated onto a reference surface and a measurement surface; a light detecting element to capture an interference pattern; and a control computer to obtain surface shape data through white-light interference pattern analysis from an image captured and detect whether or not the measurement surface is defective from the obtained data, wherein a subsidiary light source to provide falling illumination to the target object; and two-dimensional data and three-dimensional data regarding the surface shape of the target object are obtained by selectively intermitting the turning-on of the main light source and the subsidiary light source and the irradiation of the illumination light onto the reference surface.
Abstract:
The three-dimensional shape measuring apparatus includes a light source; a beam splitter to split illumination light from the light source; a target object to be measured, having a height difference between the highest point and the lowest point; a reference mirror, on which another beam emitted from the beam splitter is irradiated; a light detecting element to detect an interference pattern generated by the interference of an object beam reflected by the surface of the target object and a reference beam reflected by the surface of the reference mirror; and a control computer to process an image detected by the light detecting element, wherein a subsidiary reference beam generating unit to change the optical path of the beam from the beam splitter to generate a subsidiary reference beam is provided between the beam splitter and the reference mirror.