Invention Application
WO2010039409A3 APPARATUS AND METHOD FOR CLEANING SEMICONDUCTOR SUBSTRATE USING PRESSURIZED FLUID
审中-公开
用加压流体清洗半导体衬底的装置和方法
- Patent Title: APPARATUS AND METHOD FOR CLEANING SEMICONDUCTOR SUBSTRATE USING PRESSURIZED FLUID
- Patent Title (中): 用加压流体清洗半导体衬底的装置和方法
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Application No.: PCT/US2009056679Application Date: 2009-09-11
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Publication No.: WO2010039409A3Publication Date: 2010-05-20
- Inventor: CHEN HUI , D AMBRA ALLEN L
- Applicant: APPLIED MATERIALS INC , CHEN HUI , D AMBRA ALLEN L
- Assignee: APPLIED MATERIALS INC,CHEN HUI,D AMBRA ALLEN L
- Current Assignee: APPLIED MATERIALS INC,CHEN HUI,D AMBRA ALLEN L
- Priority: US24368508 2008-10-01
- Main IPC: H01L21/304
- IPC: H01L21/304 ; H01L21/302
Abstract:
Embodiments of the present invention generally relate to an apparatus and a method for cleaning a semiconductor substrate after a polishing process. Particularly, embodiments of the present invention relates to an apparatus and method for cleaning a substrate using pressurized fluid. One embodiment of the present invention comprises two rollers to support and rotate a substrate in a substantially vertical orientation, a pressure wheel to apply a force to engage the substrate with the two rollers, and a swinging nozzle configured to dispense a pressurized fluid towards the substrate.
Information query
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